CSM_EE-SY1200_E_1_1
EE-SY1200
Photomicrosensor (Reflective)
■ Dimensions
(Unit: mm)
■ Features
? Ultra-compact model.
Detector center
Emitter center
Note.
Unless otherwise specified tolerances
are ±0.15.
? PCB surface mounting type.
? High S/N ratio
( 0.7 )
(1)
3.2
(0.8)
(0.8)
1.9
No burrs dimensions are included in out-
line dimensions.
The burrs dimensions are 0.15 MAX.
Diagonal line indicate the region is part
Au plating area.
(High light current / Low leakage current)
■ Absolute Maximum Ratings
(Ta=25 ° C)
Item
Symbol
Rated value
Unit
Recommended Soldering Pattern
Forward current
I F
50 *1
mA
1.1
2-1
2-1.7
2-1
Emitter
Pulse forward
current
I FP
500 *2
mA
Reverse voltage
V R
4
V
E
1.2
K
2-0.65
2-0.45
Collector-Emitter
voltage
V CEO
30
V
C
0.7
A
2-0.65
Note 1. The shaded portion in the
above figure may cause short-
ing. Do not wire in this portion.
Detector
Emitter-Collector
voltage
Collector current
V ECO
I C
5
20
V
mA
2. The dimensional tolerance for
the recommended soldering
pattern is ± 0.1 mm.
Collector dissipa-
tion
Operating temperature
P C
Topr
50 *1
? 25 to +85
mW
° C
Terminal No.
A
Name
Anode
Internal Circuit
Storage temperature
Reflow soldering temperature
Tstg
Tsol
? 40 to +100
240 *3
° C
° C
K
C
E
Cathode
Collector
Emitter
C
E
A
K
*1. Refer to the temperature rating chart if the ambient tem-
perature exceeds 25 ° C.
*2. The pulse width is 10 μ s maximum with a frequency of
100 Hz.
*3. Complete soldering within 10 seconds for reflow soldering.
■ Electrical and Optical Characteristics (Ta=25 ° C )
Value
Item
Symbol
MIN.
TYP.
MAX.
Unit
Condition
Forward voltage
V F
---
1.2
1.4
V
I F = 20 mA
Emitter
Reverse current
I R
---
---
10
μ A
V R = 4 V
Peak emission wave-
length
Light current 1
Light current 2
Dark current
Detector Leakage current 1
Leakage current 2
Collector-Emitter satu-
rated voltage
Peak spectral sensitivi-
ty wavelength
Rising time
Falling time
λ P
I L 1
I L 2
I D
I LEAK 1
I LEAK 2
V CE ( sat )
λ P
tr
tf
---
200
150
---
---
---
---
---
---
---
940
---
---
2
---
---
---
850
30
30
---
1000
---
200
500
200
---
---
---
---
nm
μ A
μ A
nA
nA
nA
V
nm
μ s
μ s
---
I F = 10 mA, V CE = 2 V, Aluminum-
deposited surface, d = 4 mm* 1
I F = 4 mA, V CE = 2 V, Aluminum-de-
posited surface, d = 1 mm* 1
V CE = 10 V, 0 l x
I F = 10 mA, V CE = 2 V,
with no reflection* 2
I F = 4 mA, V CE = 2 V,
with no reflection* 2
---
---
V CC = 2 V, R L = 1 k Ω ,
I L = 100 μ A, d = 1 mm* 1
V CC = 2 V, R L = 1 k Ω ,
I L = 100 μ A, d = 1 mm* 1
*1. The letter “d” indicates the distance between the top surface of the sensor and the sensing object.
*2. Depends on the installed condition of the Photomicrosensor, the detector may receive the sensor's LED light and/or the external light which
is reflected from surroundings of the Photomicrosensor and /or the background object.
Please confirm the condition of the Photomicrosensor by actual intended application prior to the mass production use.
1
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